Optimized bonding process for flexible labels
When precision meets sensitivity, you need a process that combines both: The Functional Foil Bonding Adhesive process has been specially developed for the automated bonding of flexible labels - even on sensitive components. Whether touch sensors, LED foils, or other decorative functional elements, FFB Adhesive allows them to be applied safely, quickly, and with minimal damage to the material. The result is a reliable, durable bond without heat or pressure, ideal for sensitive materials and challenging geometries.
The process at a glance
The FFB Adhesive process begins with the precise insertion of the component into a defined holder. At the same time, the flexible label is moved into the correct position. A robot arm picks up the label and guides it to a dispenser, which applies the specially developed, optically transparent adhesive to the label in defined shapes. The robot then places the label precisely on the component and presses it evenly into place with a targeted rolling action. This ensures that the adhesive is distributed homogeneously and in a controlled manner without air pockets. Final curing takes place using UV light – quickly, gently and without thermal stress. The finished component can be removed immediately and processed further without any additional steps.
Advantages for your application
- Gentle processing: No pressure, no heat – ideal for sensitive labels, decorations, and electronics
- Efficient & automated: The entire process is designed for high repeat accuracy and process reliability
- Immediately ready for further processing: Thanks to UV curing, no autoclave or further curing is necessary
- Maximum flexibility: Suitable for 2D and 2.5D components with complex geometries
- Turnkey solution from a single source: If required, KURZ can supply the process, equipment, adhesive, and label – perfectly coordinated
Ideal for complex requirements
FFB Adhesive is specially designed for situations where conventional processes reach their limits, such as sensitive decorations, delicate electronics, or complex surfaces. Processing is carried out entirely without thermal or mechanical stress. This makes the process ideal for components that cannot tolerate pressure or heat.
Compared to the classic OCA lamination process, there is no need for the release liner to be removed from the labels, which is difficult to automate. Adhesive activation via UV light enables precise control, short cycle times, and high process reliability. FFB Adhesive can be seamlessly integrated into existing production lines without restricting shaping, material selection, or design freedom.
